Kingston Technology KTL-TS564D4-96G memory module 96 GB 1 x 96 GB DDR5 6400 MT/s 288-pin DIMM ECC

Kingston Technology KTL-TS564D4-96G. Component for: Server, Internal memory: 96 GB, Memory layout (modules x size): 1 x 96 GB, Internal memory type: DDR5, Memory form factor: 288-pin DIMM, CAS latency: 52, ECC

Up to 6800MT/s
Kingston FURY™ Beast DDR5 memory provides superb speed, capacity and reliability for next-gen gaming platforms. Level up your machine’s performance with enhanced features like on-die ECC for better stability and dual 32-bit subchannels to boost efficiency. Kingston FURY Beast DDR5 offers overclock specs for Intel® XMP 3.0 and AMD EXPO™ with customisable profiles for speeds and timings to help you wring the most from your gaming experience, livestream at 4K+ or push animation and 3D rendering projects.

Kingston FURY™ Beast DDR5 memory brings the latest, cutting-edge technology for next-gen gaming platforms. Taking speed, capacity and reliability even further, DDR5 arrives with an arsenal of enhanced features, like on-die ECC (ODECC) for improved stability at extreme speeds, dual 32-bit subchannels for increased efficiency and an on-module power management integrated circuit (PMIC) to provide juice where it’s needed most.

Superior speed advancements, with double the banks from 16 to 32 and double the burst length from 8 to 16, take DDR5 memory, your gaming experience and your overall system applications to the next level of performance.
Whether you’re pushing the limits in your gaming with the most extreme settings, live streaming at 4K+ or pushing large animation and 3D rendering, Kingston FURY Beast DDR5 memory is the level-up needed, while seamlessly bridging style and unleashing performance.

With options featuring Intel XMP 3.0 or AMD EXPO, two new DDR5 overclock specs that include customisable profiles for speeds and timings, Kingston FURY Beast DDR5 has your compatible overclock solutions covered."

Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain the ultimate performance while you push the limits!

Increased efficiency
Boosted by double the banks and burst length and two independent 32-bit subchannels, DDR5’s exceptional handling of data shines with the latest games, programs and demanding applications.

Intel® XMP 3.0 certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.

AMD EXPO certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice.

Qualified by the world’s leading motherboard manufacturers*
Tested and approved so you can build and upgrade with confidence on your preferred motherboard.

Low-profile heat spreader
Newly designed heat spreaders in black or white combine bold styling and outstanding cooling functionality.

ThinkSystem TruDDR4 Memory delivers trusted, tested, quality, performance, and reliability throughout the ThinkSystem portfolio. We use the highest quality industry-standard memory components sourced from Tier 1 DRAM suppliers. Only memory that meets these strict requirements are selected for TruDDR4 Memory. It is then compatibility tested and tuned on every ThinkSystem server to maximize reliability.

High Performance Memory

Lenovo offers high-performance and high-capacity memory options in ThinkSystem servers.

Persistent Memory

Lenovo ThinkSystem servers configured with Intel Optane DC Persistent Memory transforms the memory/storage hierarchy enabling faster insights from data. This breakthrough technology delivers large capacity, high speed, affordable memory with data persistence and advanced encryption capabilities. These DDR4 compatible modules significantly increase the capacity of available system memory, keeping more hot data closer to the CPU, and enabling greater operational efficiency by processing larger data sets with more user instances.

3DS RDIMMs

To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.

Performance+ Memory

Memory intensive workloads needing a competitive advantage will benefit from Lenovo’s Performance+ memory. Lenovo engineers worked in partnership with leading memory suppliers to develop and tune ThinkSystem servers enabling them to exceed the latest industry standard for memory performance. Lenovo’s Performance+ memory delivers increased bandwidth and lower latency at 2933 MHz with memory all channels fully populated.

ValueRAM, Kingston’s industry standard memory, delivers award-winning performance and legendary Kingston reliability. When you know what you want, you want ValueRAM.

ValueRAM, Kingston’s industry standard memory, delivers award-winning performance and legendary Kingston reliability. When you know what you want, you want ValueRAM.